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Solderless connections - Compression mount connections. General requirements, test methods and practical guidance

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Description

Solderless connections - Compression mount connections. General requirements, test methods and practical guidance1 Scope and object This part of IEC 60352 is applicable to compression mount connections with metallic spring contacts for use in telecommunication equipments and in other electronic devices employing similar techniques. Information on materials and data from industrial experience are included in addition to the test procedures to provide electrically stable connections under prescribed environmental conditions. The object of this part of IEC 60352 is

Perfume manufacturers

Plastics industry

It does not provide procedures for interpreting the core strength results

cleanability and sterilizability

Guidance on application of this International Standard Bibliography

Anyone involved in legal

This standard has been written for manufacturers of health software

Inspection agencies involved in the inspection of chain wheels

and registration authorities as defined in the CCITT Recommendation T

It updates the previous edition of BS 2869 to include revised specifications

Relevant compliance bodies

9 Model for uncertainties and covariances associated with the yi

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